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Single Wafer Processor

Product Detail Information

Features

Application wafer size
4"& 12" wafer
Process area
Front & Rear side
Process chamber
1 functional chamber
Cassette stage
1 stage
Wafer handling robot
3-axes single-blade robot
Wafer chuck
Mechanical chucking type
High system reliability
Wafer mapping system by robot
Easy operation with touch panel
Chemical mixing
In-line mixing or chemical mixing unit
Data interface protocol
Host communication with GEM/SECS II & HSMS
Option
Ozone process, Bevel cleaning